Page 11 - PEN eBook July 2022

COOL YOUR POWER

SEMICONDUCTOR RELIABLY

WITH THE COMPACT HZ210

ACTIVE HEAT SINK.

Developing engineers are faced with a challenge when it comes to the choice of a suitable

cooling con-cept for power electronics. This is particularly the case with flat housings, where
corresponding know-how is required. Thought should be given to this issue during the concept
phase, as it may prove difficult to solve this problem if there is very little space for dissipating
heat. SEPA EUROPE has developed a smart solution for such requirements — namely, the HZ210,
an in-house development that is available in dif-ferent dimensions. SEPA EUROPE has developed
the new high-performance active heat sink HZ210 using the powerful LY60B radial fan. The case
study achieved an impressively low thermal resistance of 0.5 K/W during laboratory testing. With an

overall height of a mere 25 mm, this opens up new possibilities for developers to enable the cooling
of power components in flat housings. In the event that a temperature increase of 40 K is allowed,
80-W power loss can be reliably dissipated. The cooling system comprising SEPA blower, extruded
heat sink, and cover plate keeps the noise at a comfortably low level. The microphone recorded no
more than 34 dB(A) in the anechoic chamber. The fan is available in 5-V and 12-V versions and has
a service life of 210,000 hours (MTBF) at 40˚C thanks to its reliable MagFix© sleeve bearing.

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