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22 EE|Times EUROPE

Silicon Carbide Modules Unlock Higher Power Density in Motor Drives

Figure 2: An XM3 module (top), size comparison (bottom left), and a side view showing XM3’s non-planar power leads (bottom right)

Figure 3: Wolfspeed uses Wieland Microcool’s MDT technology, which enables 20 fins/inch (FPI) against standard 12 FPI to lower
thermal resistance and allow uniform cooling.

footprint. The XM3 platform offers below, to increase heat-dissipation efficiency, sides, as well as high pressure drop, resulting
switching-optimized and conduction- reduce parasitic inductance, and decrease in inconsistent cooling across the surface and
optimized products for different target component count as well as size. on both sides.
applications, such as the CAB450M12XM3 The CRD600DA12E-XM3 instead uses
1,200-V, 450-A, half-bridge module used in THE COLD PLATE Wieland Microcool’s micro-deformation
this system. The high current density enabled by SiC technology (MDT) in the cold plate (Figure 3).
Features of the XM3 platform include devices requires a high-performance thermal MDT is a patented, low-cost, non-subtractive
an integrated temperature sensor on the stackup to maximize heat transfer. Among the manufacturing process that mechanically and
low-side switch position; built-in voltage many options available in heatsinks, pressed plastically deforms the work piece to form
sensing (de-sat) connection for easy driver copper tubes are the popular economical finite and repeatable micro-channels.
integration; and a high-reliability silicon choice for liquid-cooled cold plates. While This is the basis of the high-performance
nitride (Si N ) power substrate for enhanced thin (~12.7 mm) copper-tube cold plates that cold plate with embedded channels that cool
3
4
power-cycling capability. support module mounting on both sides are the full contact area of the XM3 module.
The inverter system performance is further available, they do have disadvantages: high The profile of the double-sided CP4012D-XP
enabled by several technologies, described thermal resistance that is different for the two plate is optimized to match the XM3 module
NOVEMBER 2021 | www.eetimes.eu