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            PARTNER CONTENT
           Silicon Carbide Modules Unlock Higher Power

           Density in Motor Drives



           By Matthew Feurtado, Applications and Systems Engineer, and Daniel Martin, Senior Manager of Applications
           Engineering, Wolfspeed

           The traction drive is where nearly all of an electric vehicle’s energy is put to use.
           This paper presents a three-phase dual inverter reference design from Wolfspeed
           and reveals how its components, including the CAB450M12XM3 power module and
           CGD12HBXMP gate driver, along with other key technologies, come together in a
           solution designed to enable next-generation EV traction.



                 he traction drive system of an   In designing the system, five key points   POWER MODULE PLATFORM
                 electric vehicle must perform with   needed to be considered:     OF CHOICE: XM3
                 the highest possible efficiency while   1.  The high power density achievable from   A power module based on Wolfspeed’s XM3
           T occupying the smallest possible space   the use of SiC technology. Although SiC   full-SiC platform was the obvious choice
           with the lowest weight — all to maximize   enables higher temperature operation,   because of its exceptional power density. Its
           the EV range. With the use of dual drives   the high power density enabled requires   weight and volume are about half as much
           to enhance traction as well as an 800-V   that advanced heat-dissipation technolo-  as the standard 62-mm module, and the
           architecture to reduce losses, the industry   gies be used.             difference is even more dramatic against an
           needs inverters that increase output power   2.  The fast switching speeds make the sys-  EconoDUAL (Figure 2). The XM3 platform
           from smaller size to deliver power density   tem more prone to overshoot and ringing   is designed using an overlapping planar
           well beyond the capability of silicon-based   caused by stray inductance; thus, stray   structure to achieve low stray inductance.
           technologies like IGBTs. The latest gener-  inductance needs to be lowered from the   The current loops within the module are wide
           ation of Wolfspeed’s silicon carbide power   busbar structure.          and low-profile and yield even distribution
           modules are designed to meet these demands   3.  This concern also demands low-   between the devices, resulting in equivalent
           with lower losses, higher power density, and   inductance, high-ripple rating capac-  impedances across a switch position. The
           smaller size.                          itance while keeping an eye on size   power terminals on the module are also
                                                  reduction.                       vertically offset. This enables design of simple
           A SYSTEM OVERVIEW                     4.  The gate driver circuit must have   busing between the DC-link capacitors and
           The CRD600DA12E-XM3 comprises two banks   adequate drive strength to sustain the   the module to be laminated all the way up to
           of CAB450M12XM3 power modules, each with   switching speeds demanded and enabled   the module. The end result is a power-loop
           CGD12HBXMP gate drivers (Figure 1). The   by SiC technology.            stray inductance of just 6.7 nH at 10 MHz.
           overall objective is to maximize performance   5.  The overall power density should be    The module features half the stray induc-
           through a high-ampacity, low-inductance   significantly high to meet end-   tance of industry-standard modules and
           design that is also low in cost and complexity.  application requirements.  less than half the volume in a 53 × 80-mm


























           Figure 1: The system block diagram (left) showing three main components: the two converter modules, each with a gate driver, and the
           controller. The power modules mounted on the cold plate (A), and then in the power core with gate drivers (B), are also shown outside the
           dual inverter enclosure (C). Handles and feet are provided for portability. D shows the 204 × 267.5-mm cross-section.

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