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                                                         Wide-Bandgap Semiconductors Find Homes in Space


        necessary to select components in which the effects produced by radia-
        tion have been measured and declared.
        WBG ADVANTAGES IN SPACE-BORNE SYSTEMS
        Reduced weight and size, together with high efficiency and reliability,
        are fundamental requirements for components intended for use on
        spacecraft. GaN power devices provide the highest level of efficiency
        in the smallest footprint available today. Gallium nitride also has
        excellent characteristics in terms of electromagnetic compatibility
        (EMC): The reduced parasitic capacitance decreases the energy stored
        and released during the switching cycles, while the reduced footprint
        improves the loop inductance, particularly insidious as it acts as a
        transceiver antenna.
          Power devices used in critical applications such as space mis-         Figure 3: Freebird’s GaN adapter module
        sions, high-altitude flights, or strategic military applications must be            (Image: Freebird Semiconductor)
        resistant to failures and malfunctions caused by ionizing radiation.
        Commercial GaN power devices offer significantly higher performance
        than  traditional rad-hard devices based on silicon technology. This   tested for TID radiation. The ISL7023SEH 100-V, 60-A GaN FET and
        allows the implementation of innovative architectures for applications   ISL70024SEH 200-V, 7.5-A GaN FET provide up to 10-orders-of-
        in satellites, data transmission, drones, robotics, and spacecraft.  magnitude-better performance than silicon MOSFETs while reducing
                                                              package size by 50%.
        ENHANCED GaN HEMT                                       They also reduce power supply weight and achieve higher power
        Rad-hard MOSFETs have reached their technology limits with large die   efficiency with less switching power loss. At 5-mΩ R DS(ON)  and
        sizes and a performance figure of merit (FoM), expressed by the formula   14 nC (QG), the ISL70023SEH enables the industry’s best figure of
        FoM = R DS(ON)  × C iss , which is much higher than that of an eGaN transis-  merit. Figure 1 shows the very low R DS(ON) .
        tor. The FoM is a very important parameter: The smaller the value, the   VPT Inc. offers the SGRB series of DC/DC converters, specifically
        better the efficiency of the system.                  designed for harsh radiation environments in space applications. Based
          In addition, eGaN HEMTs are easier to drive, as they require 10× to   on advanced GaN technology, the SGRB series provides high efficiency,
        40× less gate charge than the best rad-hard MOSFETs. GaN devices can   resulting in reduced system size, weight, and cost.
        also be mounted directly on the ceramic substrate without requiring   With up to 95% efficiency, the series’ GaN technology results in
        any external package. It is possible to eliminate wire bonds and related   greater efficiency compared with traditional radiation-hardened silicon
        inductance, enabling very high switching rates. The eGaN switching   products. It has been designed specifically for space-borne telecommu-
        speeds are determined only by the resistance and capacitance of the   nications in which high efficiency, low noise, and radiation tolerance
        gate and drain nodes.                                 are imperative (Figure 2).
          Switching times can easily reach sub-nanosecond levels, so particu-  Freebird Semiconductor offers a wide selection of high-reliability
        lar attention should be paid to both the design and PCB layout phases   GaN HEMT discrete devices integrated into GaN adapter modules
        of development when using these high-performance devices.   (GAMs), creating the patented circuitry found in its multifunction
                                                              power module series. These universal GaN adapter modules (Figure 3)
        RAD-HARD GaN SOLUTIONS                                incorporate eGaN switching power HEMTs with GaN-based high-speed
        Renesas Electronics, a leading supplier of advanced semiconductor   gate drive circuits for use in commercial satellites.
        solutions, has developed the industry’s first rad-hard 100-V and 200-V   The rad-hard FBS-GAM01-P-C50 single low-side power development
        GaN FET power solutions, suitable for enabling primary and secondary   driver module incorporates GaN switching power HEMTs in a nine-pin
        DC/DC converter power supplies in space-borne systems. These GaN   SMT overmolded epoxy package. Integrated devices include Freebird’s
        FETs have been characterized for destructive single-event effects and   FDA10N30X output power eGaN HEMT switch and an output clamp
                                                              Schottky diode, optimally driven by high-speed gate drive circuitry
                                                              consisting entirely of eGaN switching elements. It also includes 5-V
                                                              input V BIAS  overvoltage clamping protection with V BIAS  undervoltage
                                                              driver disable and reporting. The SMT overmolded epoxy package pro-
                                                              vides an engineering development platform for the FBS-GAM01-P-R50
                                                              flight unit version.
                                                              CONCLUSION
                                                              A reliable, continuous power supply is essential to the success of a
                                                              space mission. In real-world applications, the main advantage of
                                                              switching to SiC- or GaN-based broadband semiconductors is the
                                                              increased power conversion efficiency.
                                                                The ability of SiC- or GaN-based broadband semiconductors to oper-
                                                              ate at high temperatures also has significant advantages. Not only can
                                                              these devices be used in higher heat environments, they require less
                                                              overall cooling, reducing the space and cost of cooling components in
                                                              the power converter. ■

                                                              Maurizio Di Paolo Emilio is a staff correspondent at AspenCore,
        Figure 2: VPT’s SGRB series of DC/DC converters (Image: VPT Inc.)  editor of Power Electronics News, and editor-in-chief of EEWeb.

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