Page 46 - PEN Ebook May 2021
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Test & Measurements                                                                                                                                                                                   Test & Measurements


          There are better or worse solutions depending        the performance increase of computers cannot be                                                                                         CONCLUSION

          on the type of application. The second option is     neglected but, finally, every simulation is only as                                                                                     The renaissance of power elec-
          to use the best semiconductor available. New         good as the models and the supplied data are. Pas-                                                                                      tronics is a result of current
          semiconductor materials have found their way to      sive components are an example. Typically, speci-                                                                                       market trends. Efficient and
          the market. The wide band gap materials (WBG)        fications of passive components are changing with                                                                                       reliable power converters be-
          like Silicon Carbide (SiC) or Gallium Nitrite (GaN)   the use case. For example, ceramic capacitors have                                                                                     came the crucial part in many
          are the most prominent ones. Both have low-          different capacity at different bias voltages, or the                                                                                   designs. New semiconductor
          er losses (switching/conducting), have a higher      inductance of coils change with the current. The                                                                                        materials give their contribu-
          voltage withstand and support faster switching       datasheet of components most of the time does                                                                                           tion and open several new pos-
          frequencies. But, as it constantly happens, noth-    not represent this. ESR, ESL or AC resistance are                                                                                       sibilities for design engineers,

          ing comes for free. Obviously, new and modern        not given for the frequency of the real use case. It                                                                                    but also bring new challenges
          semiconductors might stand in conflict with the      is therefore necessary to measure the components                                                                                        with them. To get insights and
          requirement on lower cost. But on a second view      under real conditions before it make sense to feed                                                                                      be able to get the best out of
          there is no real conflict there. SiC/GaN devices     them into the simulation tool. Furthermore, there                                                                                       the design it is still necessary
          are indeed more expensive compared to well-es-       are Must-Have tests like EMC Compliance and re-                                                                                         to do extensive measurements.
          tablished Silicon-based MOSFETs, but the poten-      liability testing. Also, performance specifications of                                                                                  Siglent has extended its meas-
          tial for cost saving lies in the fact that they allow   the final product like power consumption, dynamic                                                                                    urement equipment during the

          using less and/or smaller components or heat         response need to be proved by measuring.                                                                                                last years and can now offer a
          sinks. Another challenge is the lack of experience                                                                                                                                           wide set of products to help
          with using SiC and GaN and this might lead to        So finally, let us have a look at the most com-                                                                                         engineers solve their tasks.
          issues (e.g. instability) during the design cycle.   mon and important measurements. For didactic
                                                                                                                                 Figure 2: Step Response.
          Also, higher switching frequency is a brilliant      reasons, we might start with the measurement of
          source for EMC emissions, and this is crucial as,    the dynamic response, which is typically done at                  To achieve an optimized design and finish
          in the end, there is a standard to which the prod-   a later stage in the development process, but it                  everything within the given time it is suggested
          uct must comply.                                     clearly shows what happens if the design is not                   to start measuring as early as possible. Ideal-
                                                               properly done. During the measurement of the                      ly, the first task should be to optimize the inner

          Meeting the requirements of a smaller size and       Load Step Response the load current steps be-                     “core” i.e., the switching stage. A proper layout
          weight is mandatory if the product is designed       tween e.g. 10% and 90% of the maximum current.                    is crucial here to avoid high frequency ringing
          for the wearables market, lower weight is also       Parallel to the current, the output voltage will be               caused by LC resonances (CDS / Ltrace). Fur-
          an important specification for electrification       measured. Top section of figure 2 shows inten-                    thermore, the dead-time between high-side and
          of transportation no matter if it is for drones      sive ringing. This can be an issue when it comes                  low-side switching has to be proper. If too tight,
          or cars. The new WBG-switches can also offer         to EMC testing. As shown, oscillations point to an                short circuits can happen and if it is too long,
          a solution here, but as mentioned above, this        insufficient stability of the design and issues at                efficiency goes down.

          brings EMC with them. Ensuring reliability and       the feedback loop. To get more insights, the next
          stability, EMC compliance, meeting costs and         step should be measuring the loop response and
          space as well as the ability to connect the T&M      determining phase and gain margin with the help                   For More Information
          equipment are the most relevant challenges.          of a Bode Plot. All Siglent X-Series oscilloscopes
                                                               include this functionality and make testing easy
          Another interesting question is: Do we still need to   and affordable. After the design has been opti-                        ▶ Testing! Not Guessing! Talk at Power Forum 2020
          measure or can simulation make testing obsolete?     mized and the phase margin has been increased
          Truly, the recent developments and improvements      the result of the load step response looks just as                       ▶ GaN and SiC
          on simulation software and models combined with      in the bottom section of the picture (figure 2).


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