Page 27 - PEN Ebook May 2021

Semiconductors POWER SUPPLY

Device packaging is also an important topic. (QDPAK) package is Infineon innovative pack-
Traditional through hole devices in TO247 have age which perfectly addresses top side cooling
become standard in many OBC designs. Howev- requirements. The QDPAK provides Kelvin Source

er, assembly automation requires surface mount connection and high creepage distance in a sur-
devices (SMD) with appropriate package creepage face mount package. As the current increases, a
and clearance to reduce costs. With SMD devic- TO247-4pin is also planned with the same cri-
es the entire printed circuit board assembly with teria of providing Kelvin Source and high creep-
power devices can be assembled in a single step. age in a large current carrying capable package. Choosing the Right
The latest PG-TO263-7pin package with high To complement SiC Mosfet and diode offering,
creepage and Kelvin Source connection address- Infineon also made these packages available for Supercapacitor for your
es 1200V SiC Mosfets. PG-TO263-2pin package is legacy silicon technology for IGBT, Diodes and
suitable for SiC diode devices where the middle Superjunction Mosfets. This will offer a com-

pin is completely removed to address creep- plete solution for OBC application in the view Application
age requirements. In addition, Top Side Cooling of efficiency, cost and ease of assembly. Figure
surface mount devices will further improve the 4 illustrates innovative packages from Infineon By Roya Nikjoo, Field Application Engineer, KEMET Corp
performance of SiC device by reducing thermal targeting OBC application.
resistance from the package to the cooler while Supercapacitors have emerged as a popular solu- Before we look in further detail at how to choose
simplifying power device assembly. PG-HDSOP-22 tion for those situations in which when high-den- the right supercapacitor for your application, it is
sity back-up power is required, along with high worth setting out the fundamentals of how such

cycle life and fast charge and discharge times. devices work, as well as some of the benefits
For More Information
they deliver over and above other technologies
However, selecting the correct type of device such as coin cell batteries. This information can
▶ (PC10) Next Generation High Voltage Discrete Power Products for Automotive for the task at hand can appear rather com- provide some valuable insight into the sorts of
plex, even for the most experienced engineer. roles for which supercapacitors are particularly
Applications, Wibawa Chou, Talk at Power Forum
It requires an understanding of a broad range well suited.
of technical performance characteristics, along
▶ Infineon Technologies with some trade-offs that need to be considered
along the way.

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