Page 26 - PEN Ebook May 2021

Semiconductors
Device packaging is also an important topic.
Traditional through hole devices in TO247 have
become standard in many OBC designs. Howev-
er, assembly automation requires surface mount
devices (SMD) with appropriate package creepage
and clearance to reduce costs. With SMD devic-
es the entire printed circuit board assembly with
power devices can be assembled in a single step.
The latest PG-TO263-7pin package with high
creepage and Kelvin Source connection address-
es 1200V SiC Mosfets. PG-TO263-2pin package is
suitable for SiC diode devices where the middle
pin is completely removed to address creep-
age requirements. In addition, Top Side Cooling
surface mount devices will further improve the
performance of SiC device by reducing thermal
resistance from the package to the cooler while
simplifying power device assembly. PG-HDSOP-22
For More Information
▶ (PC10) Next Generation High Voltage Discrete Power Products for Automotive
Applications, Wibawa Chou, Talk at Power Forum
▶ Infineon Technologies
26 MAY 2021 | www.powerelectronicsnews.com
(QDPAK) package is Infineon innovative pack-
age which perfectly addresses top side cooling
requirements. The QDPAK provides Kelvin Source
connection and high creepage distance in a sur-
face mount package. As the current increases, a
TO247-4pin is also planned with the same cri-
teria of providing Kelvin Source and high creep-
age in a large current carrying capable package.
To complement SiC Mosfet and diode offering,
Infineon also made these packages available for
legacy silicon technology for IGBT, Diodes and
Superjunction Mosfets. This will offer a com-
plete solution for OBC application in the view
of efficiency, cost and ease of assembly. Figure
4 illustrates innovative packages from Infineon
targeting OBC application.
Choosing the Right
Supercapacitor for your
Application
By Roya Nikjoo, Field Application Engineer, KEMET Corp
Supercapacitors have emerged as a popular solu-
tion for those situations in which when high-den-
sity back-up power is required, along with high
cycle life and fast charge and discharge times.
However, selecting the correct type of device
for the task at hand can appear rather com-
plex, even for the most experienced engineer.
It requires an understanding of a broad range
of technical performance characteristics, along
with some trade-offs that need to be considered
along the way.
POWER SUPPLY
Before we look in further detail at how to choose
the right supercapacitor for your application, it is
worth setting out the fundamentals of how such
devices work, as well as some of the benefits
they deliver over and above other technologies
such as coin cell batteries. This information can
provide some valuable insight into the sorts of
roles for which supercapacitors are particularly
well suited.
MAY 2021 | www.powerelectronicsnews.com 27