Page 13 - PEN Ebook March 2021
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Cover Story - Design                                                                    SEMICONDUCTORS
































          How to kill a SiC MOSFET



          – Errors in Gate Circuit


 Figure 5: Infineon/Spark Connected reference design roadmap for wireless charging.
          Design and their impact

 ure 5). The solution portfolio ranges from a 2 W   100 W inductive solution for robots and industrial
 inductive solution for low-power IoT devices (The   applications (The Ogre). It also features resonant
 Pegasus) over a 10 W inductive solution for sub-  solutions for more positioning flexibility.   on robustness
 surface smartphone charging (The Kraken) to a

          By Mehrdad Baghaie Yazdi, Martin Warnke, ON Semiconductor
 For More Information

          The emergence of SiC MOSFETs in various topol-       dampening oscillations on the gate, in order to
          ogies has resulted in great performance and          improve switching transients actually results in
   ▶ Additionally, Spark Connected recently achieved a technological breakthrough   efficiency improvements. However, if not used   heavy stress on the gate. This stress is not easily
 of scaling the power level up to 300 W charging. It made it possible to bring even   correctly, engineers can quickly find themselves   visible through measurements, as they occur on
          frustrated with device failures. These failures      the internal gate node and not on the external
 higher-power wireless charging to the market.
          are often, quite in contrast to the perception of    measurable one which, thanks to the C , seems
                                                                                                     GS
          the customers, not intrinsic weaknesses of the       nicely dampened. Furthermore, we discuss the
   ▶ To discover Infineon's highly reliable and broad-scale wireless charging solutions
          SiC MOSFET technology but in the design choic-       attention that has to be given to the SiC MOS-
 that meet all essential design requirements, please visit our dedicated Infineon   es around the gate loop. Particularly the lack of   FET body diode. There are many misconceptions

 website.   attention to the turn-on interactions between the   around the body diode of SiC MOSFETs, to the
          high side and low side device can result in cata-    point that even veteran technologists sometimes
   ▶ To learn more about how Spark Connected is transforming wireless power delivery   strophic failures excited by wrong circuit choices.   believe that this body diode is reverse recovery
          In this paper, we show that classical dampening      free. Indeed, we show that the body diode of SiC
 with innovative platforms and disruptive technology that benefit a wide variety of
          efforts using gate source capacitors in the gate     MOSFETs, in particular planar gate devices, can
 applications, please visit www.sparkconnected.com.
          circuit loop are a great hazard and an often-hid-    be a culprit in causing damage to the gate.
          den killer of SiC MOSFET gates. This practice of


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