Page 46 - EE Times Europe Magazine | February 2020
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44 EE|Times EUROPE — Boards & Solutions Insert



              AUTOMOTIVE POWER
            PCB Design Hints for Improving                                          engines, including spark-ignition (SI) as well

            IGBT Thermal Performance                                                as the more efficient, compressed-ignition
                                                                                    (CI) types.
                                                                                      To address the demand for more efficient,
            By Maurizio Di Paolo Emilio                                             less polluting engines, vehicle manufacturers
                                                                                    are following three basic strategies:
                                                                                      •  Engine right-sizing and hybridization.
                  limate change and society’s growing   Thermal management and cooling solu-  These techniques resize the engine based
                  sensitivity to environmental issues   tions are a growing concern for IGBTs because   on the class of the vehicle, maintain-
                  require the development of technical   of increased heat loss in their application.   ing the same power value. As a result, a
            Csolutions for fossil-fuel–powered   Heat losses fall into two categories: conduc-  higher number of revolutions is obtained,
            vehicles. Regulatory mandates for progressive   tion losses and switching losses.   which in turn involves a higher switching
            reductions in emissions dictate the design   Conduction losses occur during the   frequency of the injection system and
            of internal-combustion engines with lower   switched-state voltage drop through the   higher operating temperatures.
            volumes, higher engine revs, and the ability to   IGBT and depend on the current being con-  •  Dilution of the mixture. This approach
            operate with less rich fuel mixtures.   ducted. The loss of switching power occurs   requires the use of wider gaps (necessary
                                                during the switch-on and switch-off phases   for proper heat dissipation) and higher
            Insulated-gate bipolar              of the IGBT and is dependent on the current,   voltages for triggering the spark plug.
            transistors used in ignition        operating cycle, switching voltage, and   Therefore, it is necessary to use IGBTs
                                                switching frequency.
                                                                                       with higher operating voltages.
            systems must withstand              COMBUSTION ENGINE’S EVOLUTION         •  Direct injection during the compres-
                                                                                       sion stroke. This technique causes the
            high currents and have high         New emissions regulations require substantial   formation of an area rich in combustible
            clamping voltages under             changes to the design of internal-combustion   mixture near the spark plug, maintaining

            operating conditions that will
            inevitably produce a greater
            amount of heat.


              Those technological imperatives inevitably
            have implications for the operating condi-
            tions of insulated-gate bipolar transistors
            (IGBTs) used in engine ignition and control
            systems: The devices must attain higher
            clamping voltages and switching frequencies,   Figure 1:  impli ed diagram o  the test circuit (Image: Littelfuse)
            with the attendant ability to dissipate
            excess heat.
              Here, we consider the effects on the ther-
            mal performance of IGBTs using different
            thermal PCB pads under different operating
            conditions.

            IGBTS AND THERMAL PERFORMANCE
            The operating junction temperature (T vj(op) )
            is fundamental to the operation of the
            device and should be considered as a prac-
            tical value. When calculating the junction
            temperature for normal switching using con-  Figure 2: PCB pads considered during the thermal analysis (Image: Littelfuse)
            duction losses, switching losses, and thermal
            impedance, the junction temperature must
            always remain between the specified mini-
                                       even in
            mum and maximum values of T vj(op )
            overload situations.
              In practice, before the last switching event,
            the temperature of the joint must remain
                     max. The transient temperature
            below T vj(op )
            increases that result from switching losses
            in the switching event can be ignored,
            provided that the device is used within its
            safe operating area and that T vj  does not
            exceed T vj  max.                   Figure 3: Effect of a lower V ce(ON )  on the steady-state temperature (Image: Littelfuse)

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