Page 50 - PEN eBook May 2023
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DESIGN                                                                                                                                                                                                                 DESIGN



























          Figure 1: Grid-connected energy-storage elements are critical to future power T&D.



           Storage is also increasingly used to balance out   INTEGRATING BESS WITH MV GRID
          intermittent power supplies from renewable-energy    A battery energy storage system (BESS) is integrated
          resources like wind and solar.                      to an MV grid (2.3 kV, 4.16 kV or 13.8 kV) using an
                                                              isolated topology like a dual active bridge (DAB)                  Figure 2: System topology for interconnecting the BESS system to an MV grid
          SiC DRIVES STORAGE INNOVATION                       followed by an active front-end converter. A three-level
           Use of all-SiC inverters will revolutionize electricity   (neutral-point–clamped) topology reduces both the
          delivery, renewable-energy integration and energy   filter requirements compared with a two-level topology             requirement for a very low isolation capacitance in the   Using MV 3.3-kV SiC MOSFET diodes in place of
          storage. It is well recognized that silicon-based   and the voltage stress across the SiC MOSFETs.                     gate-drive circuit. Power transmission stage design   series-connected lower-voltage (1,200 V or 1,700 V)
          semiconductors have inherent limitations that reduce   Depending on grid voltage, a series connection of               objectives are high isolation requirements, low coupling   MOSFETs or IGBTs has tremendous advantages,
          their suitability for utility-scale applications. With SiC,   the SiC 3.3-kV MOSFET diode devices is possible, as      capacitance and optimized gate-driver footprint. In   including simpler gate driving, reduced parasitic
          however, power electronics applications including static   shown in Figure 2. Additional topologies can also be        general, MV applications require series connection of   inductance associated with replacing multiple
          transfer switches, dynamic voltage restorers, static var   considered for analysis. The low-voltage (LV) side is       devices for redundancy and high operating voltages.   lower-voltage transistors and rectifiers with a single MV
          compensators, high-voltage direct-current transmission   made through 1,200-V SiC devices. In the DAB, the MV          Series connection of MV SiC devices requires gate   device, lower conduction losses and higher efficiency.
          and flexible alternate-current–transmission systems all   transformer (LV to MV conversion) can be operated            drivers that can switch all devices simultaneously.   Overall size, weight and cooling requirements of the
          become economically feasible. With SiC,             between 10 and 20 kHz. A single-phase or a                         Delay in turn-on of the series-connected devices may   power converter can therefore be significantly reduced.
          medium-voltage (MV) inverter manufacturers can      three-phase system can be used depending on the                    result in voltage mismatch, leading to overvoltage or
          realize efficiencies of >97.8% at 100 kW to 1 MW,   power requirements.                                                improper voltage sharing across devices.             Tests of circuit efficiency and maximum junction
          allowing more compact inverters to be deployed                                                                                                                             temperatures on a 3.3-kV/400-A GeneSiC SiC MOSFET,
          at large scale across residential and industrial     The MV SiC MOSFETs’ fast-switching transients can
          implementations.                                    result in a dV/dt as high as 100 kV/µs, imposing a

























                                                                                                                                 Figure 3: Third-quadrant I-V characteristics measured on 3.3-kV, 40-mΩ, discrete SiC MOSFET (left) and SiC MOSFET with
                                                                                                                                 monolithically integrated MPS diode (right)

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