Page 23 - PEN eBook December 2022
P. 23

DESIGN                                                                                              Design


            CONVERTER OVERVIEW

            The  LLC  resonant  converter presented  here  features a  primary  full-bridge  and  a center-tapped
            full-wave synchronous rectifier for the secondary, as shown in Figure 1 (left). Both are coupled with a

            planar transformer having a 4:1 turns ratio. The power FETs used in the primary and secondary, together
            with the transformer and printed-circuit boards, are the key components of the module. Figure 1 (right)
            shows a photo of the overall module assembled.










 eGaN FETs Enable More




 Than 4-kW/in.  Power
 3

 Density for 48-V to




 12-V Power Conversion




 GaN transistors in a chip-scale package   Figure 1: Topology of the LLC converter (left); photo of the assembled LLC power converter module (right)


 enable higher than 4-kW/in.  power density for   POWER TRANSISTORS AND GATE DRIVERS
 3

 48-V to 12-V power conversion using an LLC   For  the  primary  circuit,  four  100-V–rated  3.2-mΩ  EPC2218s   are  used  in  conjunction  with  two
                                                                        5
                      6
 resonant converter with up to 1-kW capability.  uP1966Es  , a half-bridge gate-driver IC. For the secondary rectifier, a total of six 40-V–rated 1.55-mΩ
            EPC2067s  are used as synchronous rectifiers. These six transistors are divided into two branches,
                      7
            where each branch consists of an LMG1020  low-side gate driver controlling a parallel array of three
                                                      8
 By Alejandro Pozo, senior applications engineer at Efficient Power Conversion  EPC2067s. All  power transistors  and  gate  drivers  are  in  CSP format for  minimum  size  and  lowest
            parasitic elements.
 Growing computational power and miniaturization of electronics in computing and data centers
 is increasingly putting pressure on 48-V power delivery and conversion systems. High-efficiency   The choice of eGaN transistors is especially advantageous in the primary given the low R   × C
                                                                                                   DS(on)  OSS
 and high-power–density converters enable a reduction in power losses at the system level while   figure of merit compared with equivalent Si MOSFETs. This is because for a similar R   and voltage
                                                                                             DS(on)
 allowing smaller  form  factors. In  this context, LLC resonant  topologies combined  with GaN   rating, GaN transistors offer lower C  , therefore minimizing the magnetizing current needed to achieve
                                              OSS
 technology succeed to deliver outstanding performance, as it has been demonstrated with multiple   ZVS in as short a transition time as possible. As a result, the frequency can be increased to the 1-MHz
 examples.  This article will show the key design parameters and components to achieve beyond   range, enabling size reductions in the passive components while maintaining high efficiency.
 1–4
 4 kW/in.  of power density in a 48-V to 12-V LLC converter using eGaN FETs. This work is an evolution
 3
 of Reference 2 and was first introduced in Reference 1, demonstrating 96.3% peak efficiency and   The uP1966E half-bridge gate drivers used for the primary are an ideal match for this application, in
 93.8% when delivering 1 kW into a 12-V load and with module dimensions of 17.5 × 22.8 × 7.7 mm.  which a minimum of 80-V rating and minimum size and external components are key features. Similarly,




 40  DECEMBER 2022 | www.powerelectronicsnews.com             DECEMBER 2022 | www.powerelectronicsnews.com           41
   18   19   20   21   22   23   24   25   26   27   28