Page 75 - PEN eBook July 2023

Semiconductors

up to 1,200 V (1.7-kV devices are available in Qorvo’s Gen 3 SiC portfolio, too). It also features a
low on-resistance (R ), reducing the amount of power lost as heat and reducing the need for
DS(on)
external heatsinks.

Another key feature of Qorvo’s Gen 4 SiC FET is its ruggedness. It also has a low gate charge,
reducing the energy required to switch the device on and off, simplifying the gate driver design and
improving efficiency.

BENEFITS OF SURFACE-MOUNT TOLL PACKAGE
The surface-mount TO-leadless (TOLL) package, suitable for space-constrained applications, offers
advantages in size, performance and ease of assembly compared with traditional TO packages. The
main benefits offered by the TOLL package are as follows:

▶ Reduced size: The TOLL package is surface-mountable and leadless, which reduces its size
and footprint compared with traditional TO packages.
▶ High performance: The TOLL package is designed for high-performance power devices,
offering excellent thermal conductivity, low parasitic capacitance and inductance, high
power density and better switching performance than traditional TO packages.
▶ Ease of assembly: The TOLL package is surface-mountable, allowing easy and efficient

assembly in automated manufacturing systems.

QORVO’S NEW 750-V GEN 4 SiC FETs

Qorvo (UnitedSiC) has recently announced a 750-V/5.4-mΩ SiC FET offered in a novel surface-
mount TOLL package, extending the company’s performance leadership and broadening its portfolio
of groundbreaking Gen 4 SiC FETs. This product is the first in a line of 750-V SiC FETs, with R
DS(on)
ranging from 5.4 mΩ to 60 mΩ, that will be offered in the TOLL packaging. These components are
perfect for use in applications with limited space, such as solid-state relays and circuit breakers
that can handle 100 A of current and AC/DC power supplies ranging from several hundred watts to

multiple kilowatts.

Through acquiring UnitedSiC in October 2021, Qorvo has built a high-performance portfolio of SiC-
based FET products, enabling the company to deliver power solutions covering applications like
power conversion, motion control and circuit protection.

CHALLENGING APPLICATIONS

The new devices meet the needs for size, efficiency and cost of server power supplies, where power
density has increased above 100 W/in. because of power-hungry processors, and more power in
3
the same size (>3 kW, per AC/DC PSU) is required. Similarly, solid-state circuit breakers require
solutions able to meet the requirements of space-constrained applications, in which active cooling
is an option and the ability to withstand high currents and high voltages is mandatory.

JULY 2023 | www.powerelectronicsnews.com 75