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NEWS                                                                                                                                                      VIDEO & PODCAST






                                                                                                                                                                                                   Aspencore Media GmbH
                                                                                                                                                                                                   245 Main Street, 2nd Floor
                                                                                                                                                                                                   Cambridge, MA 02142
                                                                                                                                                                                                   Cyrus Krohn, Vice President,
                                                                                                                                                                                                   Published, AspenCore


          Semiconductor Capillary Underfill for               EPC Opens New Motor Drive Center of                                                                                                  Editorial Contact
          Advanced Silicon Node Flip Chip Applications        Excellence                                                                                                                           Brett Brune, Global Editor, AspenCore
                                                                                                                                 Enhancing Electrification and Sustainability                      Maurizio Di Paolo Emilio, Ph.D.
           Henkel has released its latest semiconductor-grade   EPC has opened a new design application center                   with Battery Technology                                           Editor-in-Chief
          capillary underfill (CUF) formulation for advanced   near Turin, Italy, to focus on growing motor drive                                                                                  maurizio.dipaolo@aspencore.com
          packaging applications.                             applications based on GaN technology in the                         In this podcast we will analyze battery technology               Lori O'Toole, Chief Copy Editor
                                                              e-mobility, robotics, drones, and industrial automation            with Vincent Pluvinage, CEO and co-founder of OneD                lotoole@aspencore.com
           Henkel has announced the commercialization of its   markets.                                                          Battery Sciences which has developed SINANODE, a
          latest semiconductor-grade capillary underfill (CUF)                                                                   set of technologies that “supercharge” the amount of              Barbara Della Porta, Copy Editor
          formulation for advanced packaging applications. The   EPC has opened a new design application center                  energy stored, speed of charging, power delivered to              Barbara.Dellaporta@aspencore.com
          material, Loctite Eccobond UF 9000AG, enables advanced   near Turin, Italy, to focus on growing motor drive            EV batteries. This proprietary and patented technology
          silicon (Si) node flip chip integration by providing robust   applications based on GaN technology in the              increases energy density and lifetime while reducing              For Reader Inquiries please contact:
          interconnect protection and compatibility with high-  e-mobility, robotics, drones, and industrial automation          costs of EV batteries. Let’s talk with Vincent.                   info@powerelectronicsnews.com
          volume manufacturing environments. While the company   markets. The specialist team will support customers
          has well-established pre-applied paste and film underfill   in accelerating their design cycles and define future
          materials for leading-edge chip technologies, this   Integrated Circuits for power management with state-                             FOR MORE INFORMATION                               Contact for Advertising
                                                                                                                                                                                                   Cyrus Krohn
          development broadens Henkel’s post-applied capillary   of-the art equipment to test applications from 400 W                               SCAN THE QRCODE >                              (206) 741-4878
          portfolio for flip chips with advanced node scaling.  to 10’s of kW.                                                                                                                     sales@aspencore.com

                         FOR MORE INFORMATION
                             SCAN THE QRCODE >                                FOR MORE INFORMATION                                                                                                 Editorial Design
                                                                                  SCAN THE QRCODE >                                                                                                Hyperbold Studio
                                                                                                                                                                                                   www.hyperbold.it





          1200V Rating Achieved on Vertical GaN Power         New DIN Rail Power Supplies for Industrial                                                                                           Copyright. All rights reserved.
          Devices                                             Applications                                                                                                                         No part of this publication may be re-
                                                                                                                                                                                                   produced in any form or by any means
           Odyssey Semiconductor Technologies has announced    The WDA series of DIN Rail power supplies provides                                                                                  without the prior express written per-
          that it has achieved the stated goal of 1200V rating on   high performance thanks to its high-runner component                                                                           mission of AspenCore. Although we make
          vertical GaN power field-effect transistors (FETs)  construction.                                                      Wine Down Friday with Steve Shultis, SVP,                         every effort to present up-to-date, accu-
                                                                                                                                 Empower Semiconductor                                             rate information, Power Electronics News
           Odyssey Semiconductor Technologies, a               Three new DIN Rail AC/DC power supplies from                                                                                        will not be responsible for any errors or
          semiconductor device company developing novel       COSEL Co. are now available for use in manufacturing                Steve Shultis has an outstanding track record                    omissions or for any results obtained
                                                                                                                                                                                                   from the use of such information.
          high-voltage power switching components based on    environments.                                                      of delivering results in both sales and business
          proprietary gallium nitride (GaN) processing technology,                                                               leadership positions over his more than 20 years in the           The digital magazine will not be lia-
          has announced that it has achieved the stated goal   Cosel’s design team has developed the new WDA                     semiconductor and electronics industries. His most                ble for any loss caused by the reliance
          of 1200V rating on vertical GaN power field-effect   family, which reduces Time-to-Market by capitalizing              recent roles included VP & GM at Foxconn Interconnect             on information obtained on this site.
          transistors (FETs). The company will begin using this   on the company’s experience and expertise in                   Technologies, and Sr. Director of Marketing & Sales at            Furthermore, Power Electronics News does
          tested technology to create product samples in Q4   developing high efficiency power conversion solutions              Foxconn Optical Interconnect Technologies where he                not warrant the accuracy or completeness
          2022 for scheduled Q1 2023 customer and internal    for demanding industrial applications optimized for                managed half a US billion dollars in revenues.                    of the information, text, graphics in this
          evaluations.                                        highly automated manufacturing.                                                                                                      digital magazine. The opinions expressed in
                                                                                                                                                                                                   the articles are those of the authors and not
                         FOR MORE INFORMATION                                 FOR MORE INFORMATION                                              FOR MORE INFORMATION                               necessarily the opinions of the publisher.
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