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NEWS                                        VIDEO & PODCAST






                                                                            Aspencore Media GmbH
                                                                            245 Main Street, 2nd Floor
                                                                            Cambridge, MA 02142
                                                                            Cyrus Krohn, Vice President,
                                                                            Published, AspenCore


 Semiconductor Capillary Underfill for   EPC Opens New Motor Drive Center of   Editorial Contact
 Advanced Silicon Node Flip Chip Applications  Excellence                   Brett Brune, Global Editor, AspenCore
          Enhancing Electrification and Sustainability                      Maurizio Di Paolo Emilio, Ph.D.
 Henkel has released its latest semiconductor-grade   EPC has opened a new design application center   with Battery Technology  Editor-in-Chief
 capillary underfill (CUF) formulation for advanced   near Turin, Italy, to focus on growing motor drive   maurizio.dipaolo@aspencore.com
 packaging applications.  applications based on GaN technology in the   In this podcast we will analyze battery technology   Lori O'Toole, Chief Copy Editor
 e-mobility, robotics, drones, and industrial automation   with Vincent Pluvinage, CEO and co-founder of OneD   lotoole@aspencore.com
 Henkel has announced the commercialization of its   markets.  Battery Sciences which has developed SINANODE, a
 latest semiconductor-grade capillary underfill (CUF)   set of technologies that “supercharge” the amount of   Barbara Della Porta, Copy Editor
 formulation for advanced packaging applications. The   EPC has opened a new design application center   energy stored, speed of charging, power delivered to   Barbara.Dellaporta@aspencore.com
 material, Loctite Eccobond UF 9000AG, enables advanced   near Turin, Italy, to focus on growing motor drive   EV batteries. This proprietary and patented technology
 silicon (Si) node flip chip integration by providing robust   applications based on GaN technology in the   increases energy density and lifetime while reducing   For Reader Inquiries please contact:
 interconnect protection and compatibility with high-  e-mobility, robotics, drones, and industrial automation   costs of EV batteries. Let’s talk with Vincent.  info@powerelectronicsnews.com
 volume manufacturing environments. While the company   markets. The specialist team will support customers
 has well-established pre-applied paste and film underfill   in accelerating their design cycles and define future
 materials for leading-edge chip technologies, this   Integrated Circuits for power management with state-  FOR MORE INFORMATION   Contact for Advertising
                                                                            Cyrus Krohn
 development broadens Henkel’s post-applied capillary   of-the art equipment to test applications from 400 W   SCAN THE QRCODE >  (206) 741-4878
 portfolio for flip chips with advanced node scaling.  to 10’s of kW.       sales@aspencore.com

 FOR MORE INFORMATION
 SCAN THE QRCODE >  FOR MORE INFORMATION                                    Editorial Design
 SCAN THE QRCODE >                                                          Hyperbold Studio
                                                                            www.hyperbold.it





 1200V Rating Achieved on Vertical GaN Power   New DIN Rail Power Supplies for Industrial   Copyright. All rights reserved.
 Devices  Applications                                                      No part of this publication may be re-
                                                                            produced in any form or by any means
 Odyssey Semiconductor Technologies has announced   The WDA series of DIN Rail power supplies provides   without the prior express written per-
 that it has achieved the stated goal of 1200V rating on   high performance thanks to its high-runner component   mission of AspenCore. Although we make
 vertical GaN power field-effect transistors (FETs)  construction.  Wine Down Friday with Steve Shultis, SVP,   every effort to present up-to-date, accu-
          Empower Semiconductor                                             rate information, Power Electronics News
 Odyssey Semiconductor Technologies, a   Three new DIN Rail AC/DC power supplies from   will not be responsible for any errors or
 semiconductor device company developing novel   COSEL Co. are now available for use in manufacturing   Steve Shultis has an outstanding track record   omissions or for any results obtained
                                                                            from the use of such information.
 high-voltage power switching components based on   environments.  of delivering results in both sales and business
 proprietary gallium nitride (GaN) processing technology,   leadership positions over his more than 20 years in the   The digital magazine will not be lia-
 has announced that it has achieved the stated goal   Cosel’s design team has developed the new WDA   semiconductor and electronics industries. His most   ble for any loss caused by the reliance
 of 1200V rating on vertical GaN power field-effect   family, which reduces Time-to-Market by capitalizing   recent roles included VP & GM at Foxconn Interconnect   on information obtained on this site.
 transistors (FETs). The company will begin using this   on the company’s experience and expertise in   Technologies, and Sr. Director of Marketing & Sales at   Furthermore, Power Electronics News does
 tested technology to create product samples in Q4   developing high efficiency power conversion solutions   Foxconn Optical Interconnect Technologies where he   not warrant the accuracy or completeness
 2022 for scheduled Q1 2023 customer and internal   for demanding industrial applications optimized for   managed half a US billion dollars in revenues.  of the information, text, graphics in this
 evaluations.  highly automated manufacturing.                              digital magazine. The opinions expressed in
                                                                            the articles are those of the authors and not
 FOR MORE INFORMATION   FOR MORE INFORMATION   FOR MORE INFORMATION         necessarily the opinions of the publisher.
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