Page 31 - PEN eBook December 2022
P. 31

Automotive                                                                           SEMICONDUCTORS

































            Power GaN for Better


 Figure 2: Time evolution of Toyota Group’s patent publications related to SiC. Patents published up to August 2021.
            Power-Conversion
 (Source: KnowMade)



 Being that cameras, radar, and LiDAR are regarded as the three primary technologies that must be   Efficiency
 coupled to  create  3D  mapping  of the vehicle  environment, Toyota  Group’s  early  patenting work  in
 these areas has benefited the company’s modern technological advancements. However, the Japanese
 company has decided to scale back its LiDAR R&D efforts in favor of systems that integrate and manage   By Dilder Chowdhury, director of strategic marketing for power GaN
 numerous sensors, particularly cameras, in a vehicle.  technology at Nexperia


 CONCLUSION  Power gallium nitride FETs are increasingly making their way into mainstream markets by providing
 Toyota’s effort in filing patents reflects its desire to play a significant role in the creation of cars of   the best power efficiency and most compact solution size. Brave innovators already benefit from
 the future. Toyota has submitted a considerable number of patent applications to cover everything   having disruptive GaN high-electron–mobility transistor (HEMT) technology as a key component

 from materials to systems, including devices, control circuits, and packaging, in all key disciplines   for their  applications,  as  it  offers the fastest transition/switching  capability  (highest  dV/dt  and
 (such as batteries, fuel cells, sensors, and power electronics). Furthermore, Toyota has broadened its   di/dt) and delivers the best efficiency, regardless of whether it is for low- or high-power–conversion
 technological scope to establish itself as a leader in critical technologies of the past, present, and   applications. Additionally, Nexperia power GaN FETs bring enhanced power density through improved
 future.    efficiency as a result of reduced conduction and switching losses combined with low-inductance
            copper-clip packaging (CCPAK).


 References  GaN  FETs  display  the  best  performance  in  all  power-conversion  applications:  server,  computing,

            industrial  automation,  telecom  infrastructure,  and  automotive.  In  the  volume/cost/performance
            spectrum, power GaN FETs using standard silicon-based manufacturing infrastructure that is easily
   ▶   KnowMade. (Sept. 27, 2022). “Insights on Toyota’s patent strategy for
 1
            scalable to larger-diameter wafers (200 mm) are at the forefront. And power GaN FET products are
 next-generation vehicles.” Press release.  being manufactured aggressively to address the volume and cost demands to support mainstream
            challenges.




 60  DECEMBER 2022 | www.powerelectronicsnews.com             DECEMBER 2022 | www.powerelectronicsnews.com           61
   26   27   28   29   30   31   32   33   34   35