Page 2 - PEN eBook February 2024
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            COMPACT. EFFICIENT. SILENT.                                                                                          Wafer-Level Test

                                                                                                                                 and Burn-In

            INFUSED BY INNOVATION.                                                                                               Advances WBG





                                                                                                                                 Reliability





                                                                                                                                  Wafer-level test and burn-in is a critical procedure   higher-power–conversion applications. Optimizing
                                                                                                                                 in the semiconductor industry, ensuring the         the packaging can aid in making the most of GaN’s
                                                                                                                                 reliability and quality of semiconductor devices.   advantages. In this issue, an article describes the
                                                                                                                                 These processes are essential for detecting and     copper-clip CCPAK packaging, which was showcased
                                                                                                                                 correcting potential flaws and malfunctions early   at the PowerUP Virtual Expo in December 2023, for
                                                                                                                                 in the manufacturing process before packaging and   cascode power GaN devices.
                                                                                                                                 delivery to customers. By conducting these tests
                                                                                                                                 at the wafer stage, manufacturers can identify and   We can all agree that lowering carbon emissions
                                                                                                                                 resolve issues promptly, minimizing the chances of   is crucial for our civilization. The best way to
                                                                                                                                 defective devices entering the market. In this issue,   accomplish this, however, is still up for debate.
                                                                                                                                 Vernon Rogers, EVP of sales and marketing at Aehr   As opposed to standard fossil fuels, which
                                                                                                                                 Test Systems, discusses the importance of these     are composed of hydrocarbons and generate
                                                                                                                                 innovative testing methodologies.                   carbon dioxide when burned, using hydrogen can
                                                                                                                                                                                     significantly reduce greenhouse gas emissions.
                                                                                                                                  Rogers noted the company’s ability to evaluate the   Crucially, when hydrogen is employed in a fuel-cell
                                                                                                                                 quality and reliability of semiconductors, including   system, its waste product is limited to water. This
                                                                                                                                 emerging materials like gallium nitride and silicon   subject will be examined by Ben Crawford, business
                                                                                                                                 carbide. These advanced testing techniques play     development manager of Kohler Power Systems
                                                                                                                                 a crucial role in assessing the dependability and   (now Kohler Energy).
                                                                                                                                 excellence of semiconductor devices, ensuring
                                                                                                                                 they meet the stringent standards of the industry.   Other topics are EV charging station design, an
                                                                                                                                 With the rise of new materials like GaN and SiC, it   innovative architecture of offline AC/DC
                                                                                                                                 becomes even more vital to employ thorough testing   power-conversion solutions, understanding the
                                                                                                                                 processes to maintain the integrity of semiconductor   impact of gate-source and power loops, battery
                                                                                                                                 products and meet the demands of evolving           testing and silicon carbide. The enhanced efficiency
                                                                                                                                 technologies.                                       provided by SiC can be attributed to its impact on
                                                                                                                                                                                     magnetic elements. High currents are required for
                                                                               WE meet @ APEC                                     GaN is highly compatible with electric-vehicle     battery charging, which usually calls for big coils.
                                                                                                                                 applications. It enables high power density,        Increasing the component switching frequency is the
                                                                                                                                 which contributes to the miniaturization of power   key to minimizing size. The difficult part of designing
                                                                                                                                 electronics components, which is advantageous in    charging systems is keeping them small and simple
                                                                                                                                 EVs, where space and weight considerations are      without being too bulky.
            State of the Art Power Modules                                   Highlights                                          significant. Saumitra Jagdale, contributing writer for
            The MagI³C FIMM Fixed Isolated MicroModule series combines the features of   • LGA-7 housing (9 mm x 7 mm x 3.1 mm)  Power Electronics News, has analyzed the features of   Yours Sincerely,
            an isolated power module with those of a classic MicroModule. It is realized in   • Ambient temp range from -40 °C to +125 °C
            an LGA-7 housing and impresses with its miniaturized dimensions. The 1 W   • Typ. 8 pF parasitic coupling capacitance  the thermal aspects of GaN power devices.         Maurizio Di Paolo Emilio
            output power can be provided up to an ambient temperature of TA = 100 °C   • Efficiency up to 91 %                                                                       Editor-in-Chief, Power Electronics News
            without derating. Features like continuous short circuit protection (SCP) and   • Certified according UL62368-1       In terms of GaN design, using a depletion-mode
            dynamic power boost up to 300 mA for 500 ms ensures a robust performance   • Dynamic and static power boost          HEMT device, the cascode design with power GaN
            for industrial applications. The module complies with EN55032 (CISPR-32)
            class B conducted and radiated emissions standard and requieres no external                                          devices has several benefits for
            components for operation.
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