Page 22 - PEN eBook March 2023
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Design                                                                                                                                                                                                  AUTOMOTIVE






                    ▶   Hoene, E., Ostmann, A., and Marczok, C. (February 2014). “Packaging Very
                    3
                   Fast Switching Semiconductors.” 8th International Conference on Integrated

                   Power Electronics Systems.

                    ▶   Huber, T., Kleimaier, A., and Kennel, R. (September 2017). “Ultra-low
                    4
                   inductive power module design with integrated common mode noise
                   shielding.” 19th European Conference on Power Electronics and Applications.


                    ▶   Bayer et al. (March 2016). “Enhancing partial discharge inception voltage
                    5
                   of DBCs by geometrical variations based on simulations of the electric field

                   strength.” 9th International Conference on Integrated Power Electronics

                   Systems.

                    ▶   DiMarino et al. (March 2020). “Design and Experimental Validation of a Wire-
                    6
                   Bond-Less 10-kV SiC MOSFET Power Module.” IEEE Journal of Emerging and                                          The Energy Ecosystem:
                   Selected Topics in Power Electronics, Vol. 8, No. 1, pp. 381–394.                                               Technologies Driving


                    ▶   Passmore et al. (2016). “The next generation of high-voltage (10 kV) silicon
                    7
                   carbide power modules.” IEEE Workshop on Wide Bandgap Power Devices and                                         the Future of

                   Applications.
                                                                                                                                   E-Mobility
                    ▶   Hohlfeld et al. (March 2012). “Stacked substrates for high-voltage
                    8
                   applications.” 7th International Conference on Integrated Power Electronics
                                                                                                                                   By Hwee Yng Yeo, e-mobility solutions lead at Keysight Technologies
                   Systems.


                    ▶   Domes, D. (May 14, 2013). Semiconductor arrangement. U.S. Patent                                           Climate concerns and evolving consumer preferences are driving technology innovations for electric
                    9
                   8441128B2.                                                                                                      vehicles as a means toward a greener transportation future.


                    ▶   DiMarino et al. (October 2017). “Design of a novel, high-density, high-                                    Innovations for this expanding e-mobility market range from smart inverters, which help to integrate
                    10
                   speed 10 kV SiC MOSFET module.” 2017 IEEE Energy Conversion Congress and                                        solar energy and other distributed energy resources into the electric grid, to ultra-fast–charging EV
                                                                                                                                   supply equipment (EVSE) and increasingly potent battery cells. These technologies also help to provide
                   Exposition.
                                                                                                                                   range assurance and drive the adoption of EVs.
                    ▶   Mouawad et al. (May 2018). “Development of a highly integrated 10 kV SiC
                    11
                   MOSFET power module with a direct jet impingement cooling system.” IEEE                                         EV sales surged by 160% in the first half of 2021 from a year earlier, to 2.6 million units globally, despite
                                                                                                                                   the global pandemic. Technological innovations including better design and test methods across the
                   30th International Symposium on Power Semiconductor Devices and ICs.
                                                                                                                                   electronic microcosms of power devices, converters, batteries and  chargers  are just some of  the
                                                                                                                                   developments helping to fuel the overall growth of the e-mobility ecosystem. Let’s explore some recent
                                                                                                                                   automotive innovations and test methods that are enabling the rolling chassis.




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