Page 2 - PEN eBook July 2022
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VIEWPOINT
SIMULATION OF THERMAL DISSIPATION
ON PCB FOR POWER MODULES PowerUP: The
Next Step in the
Evolution of Power
Electronics
This year’s PowerUP Expo Virtual Conference has seen many speakers talking about wide-bandgap (WBG)
semiconductors, energy trends, and low-power aspects. Efficiency is a driving force in all industrial sectors,
including consumer. Thanks to their savings in size, weight, and cost, as well as higher efficiency, gallium nitride
and silicon carbide power devices are making major advances beyond several applications. In the last couple
of decades, the worldwide SiC and GaN scenes have been characterized by development and growing industry
acceptance. Meanwhile, other semiconductor devices serve the needs of motor drive and power control. As
efficiency standards for these applications improve, cost-effective and energy-efficient control solutions, test
and measurement solutions, and transducers/sensors simplify design and provide a high level of integration,
as well as enhanced safety features and certified isolation capabilities. In this issue, we propose several topics,
with a section about PowerUP regarding the proceedings. Electromagnetic-compatibility (EMC) compliance is
often the last hurdle that an electronic device has to overcome in the development process. It is not rare at all
for circuit-specific and layout-specific changes to be required in the process. Gerhard Stelzer, senior technical
editor at Würth Elektronik eiSos, analyzes the new EMI Filter Designer, which can be used to design EMC filters
for conducted differential-mode interference signals. The emergence of cloud-based internet services has
initiated a strong growth of processing power, creating a clear need for highly efficient and compact server
power supplies. We will analyze how to meet the design requirements of power supplies using silicon and
WBG switches. The main topics of the PowerUP proceedings are WBG manufacturing and design features. We
summarize key aspects of SiC fabrication technology and outline non-CMOS-compatible processes that have
WE are here for you! been streamlined to allow for mass SiC device fabrication in conventional mature Si fabs. GaN has become the
de facto material in third-generation semiconductors. However, making GaN wafers in the quality you need and
Join our free webinars on:
www.we-online.com/webinars the thermal resistance you desire are challenges that fabs are still trying to overcome. Moreover, we’re dealing
with a potentially more serious issue: climate change. As the world advances toward a sustainable, greener
future, many countries are powering down fossil-fuel energy generation in favor of renewables. Industry areas
such as energy, mobility, and manufacturing are important to environmental success. Disruptions in various
REDEXPERT. • Simulation of Thermal Dissipation • Online platform based on areas are required to decrease, control, and manage the emissions problem. All talks are available on-demand
Würth Elektronik’s online platform on PCB for Power Modules measured values
for simple component selection and • The world’s most accurate • Ability to compare inductance/current by the PowerUP platform at www.powerup-expo.com.
performance simulation: AC loss model and temperature rise/DC current using
www.we-online.com/redexpert • Filter settings for over 20 electrical interactive measurement curves
and mechanical parameters • Order free samples directly Yours Sincerely,
• Inductor simulation and selection • Direct access to product datasheets
for DC/DC converters • Comfortable and clear component Maurizio Di Paolo Emilio
• Available in seven languages selection Editor-in-Chief, Power Electronics News
JULY 2022 | www.powerelectronicsnews.com 3 3
