Page 4 - PowerUp 2021 Conference Proceedings for PEN
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WIDE BANDGAP


            Wide-Bandgap



            Semiconductors: The Next



            Wave of GaN and SiC




            PowerUP’s WBG panel discussion focused on new product
            developments and how GaN and SiC semiconductors are helping to
            reduce the world’s carbon footprint.

            By Gina Roos, editor-in-chief of Electronic Products


            AspenCore’s  PowerUP Expo 2021 devoted a  full day  to  wide-bandgap (WBG) semiconductors,
            specifically gallium nitride (GaN) and silicon carbide (SiC). The WBG panel discussion focused on “the
            next wave of GaN and SiC,” taking its cue from the day’s topic presentations, including new product
            developments, technology challenges, and wafer manufacturing.



            Thanks to their savings in size, weight, and cost, as well as higher efficiency, GaN and SiC power
            devices are making big pushes beyond fast chargers and renewable energy into data centers, motor
            drivers, electric vehicles (EVs), and other e-mobility applications.


            The panel was comprised of six industry experts. Panelists in the GaN market included Alex Lidow, CEO
            and co-founder of EPC, who discussed GaN integration technology; Stephen Olivier, vice president of
            corporate marketing and investor relations at Navitas Semiconductor, who examined GaN’s role in
            electrification; and Caroline O’Brien, CEO of Kubos Semiconductor, who highlighted the company’s

            cubic-GaN technology for LEDs.


            SiC  panelists included Pete Losee, director of  technology development  at  UnitedSiC (recently
            acquired by Qorvo), who discussed his company’s expanding portfolio with 750-V Gen 4 product
            series; Paul Kierstead, global director of power product marketing at Wolfspeed, who covered SiC’s
            role in renewable energy power conversion and storage; and Rob Rhoades, president and CTO of
            X-trinsic, who provided deep insight into SiC wafer manufacturing.



            Common themes among the panelists included efficiency and integration, along with reducing the
            world’s reliance on fossil fuels with the help of WBG semiconductors. Panelists also agreed that the
            move to 200-mm wafers, coming soon, will be a further cost savings.


            GaN: EFFICIENCY AND CARBON SAVINGS
            Kubos’s O’Brien kicked off the panel with an introduction to the company’s new material technology,
            cubic GaN for LEDs. The next generation in lighting innovations is assumed to be the existing LED



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