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NEWS                                                                                  VIDEO & PODCAST















 Surface-mount Device   SCALE-iFlex LT Plug-and-Play

 Passes Board Level Reliability   Gate Driver Improves EconoDUAL
 Requirements for Automotive   IGBT Module Performance by 20%

 Application  Smart Energy for the Future of                  Is Hydrogen the next step for
 Power Integrations has announced its new   the Planet – Podcast  Energy? – Podcast
 Clip-bond FlatPower package CFP15B has, for   plug-and-play SCALE-iFlex™ LT dual gate-driv-
 the first time, passed Board Level Reliability   ers. The new drivers improve the performance   In this podcast, Robert L. Misback and Adam   In this podcast we will talk about hydrogen
 (BLR) testing for automotive applications by   of multiple parallel EconoDUAL modules by   Kabulski will explain the future of renewable   technologies with Susanné Wallner, Business
 a leading Tier 1 supplier. Nexperia has an-  20%, allowing users to eliminate one of every   energy adoption and how renewable energy is   Manager in Mariestad municipality and Patrick
 nounced that one of its surface-mount device   six modules from power inverters and con-  impacting the power grid.  Le Fèvre, Chief Marketing and Communications
 packages – the clip-bond FlatPower package   verter stacks. Power Integrations has an-  Officer for Powerbox.
 CFP15B – has, for the first time, passed Board   nounced its new plug-and-play SCALE-iFlex™
 Level Reliability (BLR) testing for automotive   LT dual gate-drivers.  FOR MORE INFORMATION >  FOR MORE INFORMATION >
 applications by a leading Tier 1 supplier.



 FOR MORE INFORMATION >  FOR MORE INFORMATION >





 GaN Systems Signs   22 kW Reference Design for an
 Semiconductor Capacity   Industrial General Purpose Motor

 Agreement with BMW  Drive


 GaN Systems has announced the signing of a   In power electronics and the semiconduc-
 comprehensive Capacity Agreement with BMW   tor market the system approach is gaining
 Group for GaN Systems’ high-performance,   momentum. To support this trend, Infineon   Wide bandgap Semiconductors   Silicon Carbide for the Future of
 automotive-grade GaN power transistors.   Technologies introduces a pretested industrial   for Greener Future – Podcast   Energy – Podcast
 GaN Systems has announced the signing of a   reference design which reduces the time to
 comprehensive Capacity Agreement with BMW   market significantl In power electronics and   In this episode, our guest is Patrick Le Fèvre,   SiC technology provides superior switching and
 Group for GaN Systems’ high-performance,   the semiconductor market the system ap-  senior marketer and degree-qualified engineer   improved thermal performance compared with
 automotive-grade GaN power transistors,   proach is gaining momentum.  with a 35-year of experience in power elec-  similar silicon devices...
 which increase the efficiency and power den-  tronics.
 sity of critical applications in electric vehicles.

                  FOR MORE INFORMATION >                            FOR MORE INFORMATION >
 FOR MORE INFORMATION >  FOR MORE INFORMATION >





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