Page 57 - Power Electronics News - December 2020
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Semiconductors                                                                               Semiconductors


 voltage, it may be even more advanced than just   from several points of view. So silicon carbide,   can see there’s a lot of people offering even 650   come for silicon carbide, similar modules for

 making a Schottky.  the substrate material is difficult to make, and   volt devices now. So I think all of this discrete   many vendors. So that’ll help people to use them
 that’s why it took a little while for the six inch   offering many package types, voltage classes,   more. And those are the applications.
 Maurizio Di Paolo Emilio (15:39): So this   material to become of high enough quality that   RDS on classes, it’s going to become very big,
 integrate-  we could release these very low resistance   kind of like silicon. Following in the footsteps of   Maurizio Di Paolo Emilio (20:59): So thank
 devices, like seven milli-ohm 650 volt, nine milli-  Silicon. Main application areas we are serving?   you so much, Anup. Thanks for your time.
 Anup Bhalla (15:40): Low voltages, I think   ohm, 1200 volt. But it’s become so good now   Automotive, battery charging, the server and the
 Schottkys will remain.  that we can think about releasing devices down,   telecom, our supplies with our 650 volt devices,   Anup Bhalla (21:03): [crosstalk 00:21:02].
 we have 5 milli-ohm and below, right? So but it   energy storage. But for us, one very important
 Maurizio Di Paolo Emilio (15:43): Yeah. So   takes awhile. And I expect the same thing will   area is solid state breakers and solid state power   Maurizio Di Paolo Emilio (21:03): I really

 this integration will give benefits for power losses   happen when we move to eight-inch. The same   controllers, trying to replace DC contactors.  appreciated your time. Very nice to talk with you.
 if I understand well?  problem because in GaN as well, because you   So thank you. Thank you so much.
 grow GaN on silicon, you’re growing a material   Maurizio Di Paolo Emilio (20:01): Yes.
 Anup Bhalla (15:50): Yeah. I think if the   that’s not lattice matched to the substrate. And   Anup Bhalla (21:08): Nice to talk to you.
 integration of the Schottky inside the MOSFET   so there’s a lot of challenges balancing the stress   Anup Bhalla (20:01): It’s a very challenging   Thanks Maurizio. Bye.
 means if you make a half bridge, you’ve got   and keeping good quality. It works well at six inch   application because of the cost and all of this,
 normal bipolar store charge, you’ve got Schottky   now. And with the passage of time, it’ll start to   but very promising because you can do so many   Maurizio Di Paolo Emilio (21:15): Okay.

 like diode recovery. And if you want to turn the   work well at eight inch as well.  things with solid state switches. And then we
 gate on, then you can even remove the knee   also have JFETs that we are making and selling
 voltage of the Schottky, the one volt knee, gone.   Anup Bhalla (18:26): So at the same, they’re   for people to integrate into fly back converters.
 So conduction losses come down.  running sort of similar types of challenges in   So there’s the beginning of more such integration
 very different materials. But of course, Silicon   where there’s an IC, like a driver plus the FET,
 Maurizio Di Paolo Emilio (16:10): Yeah.   Carbide’s been doing this for a much longer time.   or a half bridge driver plus those FETs, this
 Okay, good. So the market, as you know, is   Now, what we can expect from a technology   integration, it can be a solution to a lot of
 continuing its race towards I guess for more   improvement point of view is given that these   challenges of high speed packaging that you were
 power, if even more power. And you told me   material challenges are under good control,   talking about before.

 about silicone carbide, and we know that silicon   at least for Silicon Carbide, we see that every
 carbide and gallium nitride semiconductors   two to three years we will be reducing our   Anup Bhalla (20:35): And so I think
 bring advantages over silicon semiconductor   RDSA[MDPE3] . What resistance you get from   integration in the next few years is definitely
 for a lot of power application. So how are   what for chip area by factors of two. There’s   going to happen, right? You see a lot of power
 designers working with these new, if we can   a long way to go in Silicon Carbide. So we will   modules from different companies, but so far our
 say, semiconductors have to face some real life   release a generation four soon which reduces our   modules have been very specific or customized.   GO TO WEB ARTICLE >
 challenges in terms of design, but also substrate   own resistance per unit area by two times. And   I’m confident that standard power modules will

 wafer, and so on. What do we expect for the   then, again, in a few years we will do the same.
 next generation? What does the future hold for   So this will really help bring the cost down.
 silicone carbide? But also a look for again, if you   And I hope with all the volume growth that is   For More Information
 would suggest me something. In what areas, so   happening now, that reduces cost by itself just
 you think that there will be a good opportunity   from having high volume.
 for a good expansion of technology sales for a     ▶ UnitedSiC
 good leadership in the market?  Anup Bhalla (19:20): So it looks very good
 for Silicon Carbide to have more cost effective,     ▶ SiC Technology
 Anup Bhalla (17:31): So I’ll give you an answer   much higher technology products. And then you


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