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45 EE Times Conference
to Map the Road Ahead for
EVs, AVs 31 Book Review: Not Just Another GaN Book
47 Premium In-Car Audio The new “AspenCore Guide to Gallium Nitride: A New
Systems Have a Clear Road Era for Power Electronics” will benefit readers in both
Ahead the design engineering and executive management
communities.
SPECIAL REPORT:
ADVANCED IC
PACKAGING 32 Miniature Current Transformers Keep Pace
49 Advanced IC with GaN
Packaging: Fundamentals As we begin to realize all the promises made to us by the
for the ‘More than Moore’ proponents of GaN and SiC devices, it’s important to note
Era similar advances in the related passive components.
50 Heterogeneous
Integration and the
Evolution of IC Packaging 36 ABB’s Radjassamy on the
Drivers and Enablers of Next-Gen
52 Tighter Integration Power Systems
Between Process Raj Radjassamy, director, 5G wireless
Technologies and segment leader for ABB Power
Packaging Conversion, talks about the trends

54 Will Fan-Out Wafer- for WBG semiconductors and power
Level Packaging Keep management technologies related to
Moore’s Law Valid? renewable energy and EVs. 36

55 Five Keys to Next-
Generation IC Packaging 38 GaN Evaluation Board for AC/DC Power
Design Conversion

CULTURE Transphorm’s GaN-based platform provides the reliability
59 An Interstellar Trip of wide-bandgap semiconductor physics.
with Einstein, Newton,
and Tesla 40 Opinion: What’s Next for Electric Vehicles?

With e-mobility becoming increasingly important,
environmentally friendly battery technology is no longer
an option but a necessity.

59

www.eetimes.eu | FEBRUARY 2021