Page 57 - EE Times Europe Magazine | March 2020
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EE|Times EUROPE   57



         POWER MANAGEMENT
        Isolated Power Transfer in an SOIC Package


        By Maurizio Di Paolo Emilio

               n integrated transformer technology   power that drives a load and the ability of the
               from Texas Instruments enables a   load to function properly. Without a proper
               500-mW, high-efficiency isolated   power supply that is capable of low EMI, a
        ADC/DC power supply solution with   device (load) may not function properly or
        low electromagnetic interference (EMI).   may be damaged.
          Signal isolation in power applications   To achieve EMI compliance, typically,
        maintains integrity by preventing high-fre-  engineers need to follow the correct design
        quency noise propagation, thereby protecting   guidelines for interference reduction, adding
        sensitive circuits from high-voltage spikes. In   external components such as filters or chokes
        such applications, an isolated power supply is   to suppress noise while continually conduct-
        needed to provide power to different electrical   ing the appropriate testing to optimize the
        components. To ensure human safety, industry   design from the development stage.
        standards require reinforced isolation, which is   This is a very iterative and arduous process.   Figure 2: UCC12050DVE isolated DC/DC
        twice the necessary level of isolation required   TI’s new integrated transformer technology   power supply evaluation module
        for proper operation of the equipment.  shields against noise emissions and delivers   (Image: Texas Instruments)
          In addition to proper isolation, the market   a low-EMI isolated power supply, greatly
        is moving toward distributed power. Instead   simplifying engineers’ design tasks. The new   transformer technology embedded inside the
        of a central power supply that provides for the   UCC12050 also lets designers reduce the   package, we can also eliminate the need for
        full system, there are smaller power supplies   solution volume by 60% compared with power   external ferrite beads or chokes to mitigate
        and even micro power supplies to power the   modules (Figure 1).        EMI, which is typically done in systems
        subsystems and their components, includ-  The UCC12050‘s 5-kVrms reinforced insu-  today with just a native transformer,” said
        ing integrated circuits. Form factor, cost,   lation and 1.2-kVrms working voltage protect   Lambouses.
        and thermal management are all key design   against high-voltage spikes in systems such as   Medical applications require EMI robust-
        elements to consider when choosing solutions   industrial transportation, network infra-  ness and safety isolation, and efficiency is
        that accommodate requirements for properly   structure, and medical equipment. In these   key in test and measurement applications.
        safeguarded, distributed power.     applications and others, the UCC12050 serves   TI’s solution offers a technical combina-
                                                              as a compact isolated   tion to meet the stringent demands of both
                                                              DC/DC power supply   markets.
                                                              companion device    “Ten years ago, power density was not a
                                                              that can be used to   big concern,” said Lambouses. “We had big,
                                                              power other ICs such   massive systems. We had a single power
                                                              as digital isolators,   supply. Today, [power density] is one of the
                                                              isolated current or   key concerns from customers. With test and
                                                              voltage sensors,   measurement, medical, and factory automa-
                                                              and communication   tion equipment [all becoming] smaller, and
                                                              devices such as iso-  as power becomes more distributed, power
                                                              lated transceivers.  density is key.
        Figure 1: Typical application circuit for the UCC12050    The device, avail-  “As well, EMI is becoming a significant con-
        (Image: Texas Instruments)                            able in a 16-pin,    cern for our customers. They cannot afford to
                                                              10.3 × 10.3 ×     add cost and extra components outside of the
          “Our solutions need to have higher levels of   2.65-mm small-outline IC (SOIC) package,   chip. Instead, they are demanding that EMI
        power density and efficiency,” said Steve Lam-  eliminates some of the external components,   is mitigated or reduced inside the chip, and
        bouses, vice president and general manager of   such as low-dropout regulators and ferrite   that’s something we focused heavily on with
        Texas Instruments’ High Voltage Power busi-  beads, usually required to meet EMI certifica-  this proprietary transformer design.”
        ness. “As we put these power supplies into a   tion, shortening design time while shrinking   The silent control scheme makes it easier
        smaller space, and as we have more power sup-  the solution footprint and bill of materials. Its   for engineers to pass their projects for the
        plies than ever connected to the grid, we can’t   high efficiency and extended operating tem-  Comité International Spécial des Perturba-
        afford to waste energy. We need to provide the   perature range (from –40°C to 125°C) provide   tions Radioélectriques (CISPR) 32 Class B EMI
        highest-density and most efficient solutions.   more power under extreme conditions.  test, with margin, on a two-layer printed-
        In addition, the electrification of vehicles, the   TI’s integrated transformer technology   circuit board.
        increased need for factory automation as well   enables the conversion of high-density iso-  TI offers the UCC12050EVM-022 module
        as building automation, and other fast-growing   lated DC/DC power while maintaining a low   to help designers evaluate the characteristics
        areas, like medical, all require higher levels of   level of EMI. The surface-mount monoblock   of UCC12050DVE quickly and easily for use in
        robustness and reliability.”        architecture provides designers with an easy-  isolated systems. The EVM allows the supply’s
          In each of these applications, the most   to-use, low-profile IC that operates efficiently   features to be enabled and disabled for test. ■
        significant concerns relate to EMI, as inter-  over a wide temperature range.
        ference is amplified in tighter spaces. One   “As a semiconductor manufacturer, we are   Maurizio Di Paolo Emilio is a staff
        common EMI source is the power supply itself.   able to integrate more external components   correspondent at AspenCore, editor of Power
        Energy quality is defined as the electrical   on our die, and now, with this proprietary   Electronics News, and editor-in-chief of EEWeb.

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