Page 6 - EE Times Europe Magazine | February 2020
P. 6
4 EE|Times EUROPE
VOL 3 | NO 1 | February 2020
OPINION
12 The High-Stakes Push
to Tackle Quantum-
Compute Challenges
ARTIFICIAL
INTELLIGENCE
14 LeCun: ‘It’s Really
Hard to Succeed with
Exotic Hardware’
AI & INDUSTRY 4.0
19 In 2020, What Will Be
the Key Trends in AI and
Industry 4.0?
16 FEATURE STORY
COVER STORY 20 Optimized for Success
16 Sensing the Environment as INDUSTRY 4.0
with Human Senses 24 Designers Turning
to MEMS for Condition
Combined with appropriate software, robots and smart de- Monitoring of Power
vices can “intuitively understand” their environment, thereby Devices
simplifying our lives. The decisive factor is the interpretation ADVANCED PACKAGING
and linking o in ormation rom diff erent sensors. AND ASSEMBLY
26 EU Project Targets
Packaging for Low-Cost
EDITOR’S LETTER Manufacturing
3 Europe Confronts a New
World Order FEATURE STORY
28 New Sensor
OPINION Capabilities Enable
6 Slowly But Surely, France Faster Adoption of IoT
Moves into Quantum Technologies
QUANTUM COMPUTING MEMORY
7 France’s Quantum Plan 31 Memory with
Integrated Secure Element
7 Ensures More Data
Security
TTA AT CES
33 Taiwan Tech Arena COVER IMAGE: INFINEON
Subscribe to EE Times Europe: www.eetimes.eu/subscribe-now Takes Record 82 Startups
Unsubscribe from EE Times Europe: www.eetimes.eu/unsubscribe to CES 2020
FEBRUARY 2020 | www.eetimes.eu

