Your weekly digest of news, analysis and perspective on the global power electronics industry.

Your weekly digest of news, analysis and perspective on the global power electronics industry

Power Electronics News October 1, 2025
Your weekly digest of news, analysis and perspective on the global power electronics industry.
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Editor's Note
Maurizio Di Paolo EmilioEditor-in-Chief
Maurizio Di Paolo Emilio

The world of electric motorsports is rapidly evolving, with significant advancements in performance and safety. This is especially true in the highly competitive realm of superbike racing, where split-second decisions must be made to reduce risks while maximizing performance. This issue explores the recently announced partnership between California-based Lightfighter Racing and U.K. sensor technology specialist Metis Engineering, a collaboration that represents a crucial step forward in enhancing both safety and competitive capability for electric motorcycles. Moreover, Amit Gole, product marketing manager of Microchip Technology, explained the latest innovation in power management with the launch of the DualPack 3 (DP3) power module family, featuring advanced IGBT7 technology. Don't miss out on my latest episode of Wine Down Friday with Polar Semiconductor’s Surya Iyer and the PowerUP podcast with Hirohisa Horii, senior manager of power system marketing at Renesas Electronics, talking about robotics.

Highlights

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Lightfighter Racing, Metis Engineering Partnership Drives Electric Superbike Innovation

The Lightfighter Racing and Metis Engineering collaboration is a crucial step in enhancing safety for electric motorcycles.

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2025 Power Electronics News Survey

The survey reveals how emerging technologies, shifting applications, and evolving skills are shaping the future of the power electronics industry across AI, EVs, renewable energy, and beyond.

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Driving Industrial Performance with Microchip DualPack 3 IGBT7 Modules

Microchip Technology has unveiled its latest innovation in power management with the launch of the DualPack 3 (DP3) power module family, featuring advanced IGBT7 technology.

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Inside Robotics Power: Safety, Batteries, and Market Growth (Podcast)

Robotics is moving quickly—from drones that deliver packages to humanoids and cobots designed to work safely alongside people.

Listen Now
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Wine Down Friday with Polar Semiconductor’s Surya Iyer

Surya Iyer, President and COO of Polar Semiconductor.

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PowerUP Circuit Lab: From Schematic to PCB – Building a 3-Output Flyback Converter

An isolated DC-DC converter board based on the flyback topology.

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Smarter at the Edge: TI’s Vision for AI-Driven Connectivity

Today, we’ll look at how connectivity and embedded AI are converging to make systems smarter and more responsive across industries, such as in tire pressure monitoring and battery management systems. Texas Instruments is leading the next wave of change at the edge by combining AI, smart sensing, and wireless connectivity to improve performance, safety, and…

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Thermocouple conditioning IC reduces system complexity

Microchip claims the first single-chip, four-channel I2C thermocouple conditioning IC to deliver up to ±1.5°C accuracy.

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X-FAB joins Thalia to bolster IP migration on its process nodes

The partnership between X-FAB and Thalia aims to preserve the integrity of design transitions from one process node to another.

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Hybrid system resolves edge AI’s on-chip memory conundrum

A hybrid memory system combines the best traits of ferroelectric capacitors and memristors in a single memory stack.

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