January 29, 2025

Your weekly digest of news, analysis and perspective on the global power electronics industry.

Editor's Note

Maurizio Di Paolo Emilio – Editor-in-Chief

Silicon carbide technology is revolutionizing the power electronics industry, enabling higher efficiency, compact designs, and better thermal performance across various applications. Leading manufacturers offer SiC solutions, available as discrete power modules or bare dies, tailored to specific use cases. Let's analyze some cases. Moreover, lithium-ion batteries have served the buildout of electric vehicles (EVs) well. Engineers and embedded systems professionals are seeking improved power sources through ultracapacitors. Other topics are how to design an ultra-wide input voltage range flyback, simulations, and SiC substrates. Don't miss out on my latest episode of Wine Down Friday with Navitas’s CEO, Gene Sheridan.

Highlights

A Quick Comparison of Silicon Carbide (SiC) Solutions Across Leading Manufacturers

Silicon carbide technology is revolutionizing the power electronics industry, enabling higher efficiency, compact designs, and better thermal performance across various applications.

Can Ultracapacitors Power the Next Generation of EVs?

Experts believe ultracapacitors are the solution for mitigating the negatives of modern batteries, like life cycles and charging speeds. How true is this?

How to Design an Ultra-Wide Input Voltage Range Flyback

In modern technology, the flyback converter is one of the most widely used topologies for domestic and industrial applications that require an auxiliary power supply.

Sharpen your skills with Precision Labs

Expand your technical expertise with our comprehensive on-demand video training curriculum developed by the industry's preeminent analog IC engineers.

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Simplify power conversion in high-voltage designs

See how our innovative power conversion, sensing, isolation and real-time control technologies work together to simplify high-voltage designs, helping you reach the highest levels of efficiency and reliability.

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Wine Down Friday with Navitas’s Gene Sheridan

With over 25 years of experience in power semiconductors, Gene shares his journey through groundbreaking innovations in GaN and SiC technologies.

Simulating Foster and Cauer Models with PLECS

Thermal management is no longer a secondary consideration; it has become a crucial aspect of power electronics.

Tianyue Advanced Carves Out Role Among China’s 200-mm SiC Substrate Suppliers

Several Chinese companies offer SiC substrates used primarily in manufacturing power devices. Tianyue Advanced is one of them.

Technical article: USB Type-C® and USB Power Delivery

USB Type-C® and USB Power Delivery: Designing for both extended power range and battery-powered systems.

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MagPack™ technology: Four benefits of our new power modules

More than ever before, engineers are being asked to push more power in smaller spaces. Read our latest technical article to learn how our new power modules that leverage our proprietary MagPack™ packaging technology help achieve higher power density, greater efficiency and reduced EMI.

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From the AspenCore News Network