Increased power density in power converters, data processing, and RF ICs is a common trend across many applications. Wide bandgap (WBG) materials, like gallium nitride (GaN), are better than silicon (Si) in power conversion and RF applications because of the way they are made. In this issue, we will focus on an innovative diamond cooling technology developed by Akash Systems that has demonstrated significant advantages over legacy solutions. Moreover, EUV (Extreme Ultraviolet) lithography systems are crucial for manufacturing innovative semiconductors. We will explore China’s bold €37 billion semiconductor initiative to develop domestic EUV lithography systems and its possible threat to ASML’s market leadership. Other topics are SiC MOSFETs and H-Bridge DC Motor Drivers. Don't miss out on my latest episodes of Wine Down Friday with SMC Diode Solutions’ CEO Yunji Corcoran.